Topics Mechanical Engineering – IC Packaging ( 3D packaging) project report

Electronic Packaging Fundamentals EE/CE/Mech Eng 4v95

PROJECT TOPICS

1. NANO MATERIALS FOR ELECTRONIC PACKAGING
 
2. ADVANCED INETRCONNETCS FOR ELECTRONIC PACKAGING
 
3. 3D PACKAGING
 
FANOUT WAFERSCALE PACKAGING

5. THERMAL MANAGEMENT FOR HIGH POWER ELECTRONICS PACKAGING
 
6. ELECTRONIC PACKAGING FOR MEDICAL IMPLANTABLE DEVICES
 

Project Topics ( Hints/Pointers)

Project#3 3D Packaging
Chip on Chip, Wafer on Wafer, Package on Package stacking, interconnects like Though Silicon Vias, Through Package Vias, Assembly/processes, advantages/disadvantages etc

Project (Expectations –Submission Details)
Project Report Expectations
review summary (with at least 8 references)
Challenges foreseen connecting to technology demands and/or Applications , at least one
new/emerging concept needs to be discussed at length.
Minimum Four pages ( max 6 pages) write-up – references need to be on the additional page
Format: Introduction, Description of the technology, Uniqueness, Advantages/Disadvantages, Discussion/Inference, Conclusions & recommendations for future work, References.
Font size Times New Roman 12, Heading and subheadings in bold.

Submission Details
Project Write-up must be submitted by 5pm Monday, May 3, 2021.